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 Preliminary
Product Description
Stanford Microdevices' SXA-289 amplifier is a high efficiency GaAs Heterojunction Bipolar Transistor (HBT) MMIC housed in low-cost surface-mountable plastic package. These HBT MMICs are fabricated using molecular beam epitaxial growth technology which produces reliable and consistent performance from wafer to wafer and lot to lot. These amplifiers are specially designed for use as driver devices for infrastructure equipment in the 5-2000 MHz cellular, ISM, WLL and narrowband PCS applications. Its high linearity makes it an ideal choice for multi-carrier as well as digital applications.
SXA-289
5-2000 MHz Medium Power GaAsHBT Amplifier
Product Features * Patented High Reliability GaAs HBT Technology * High Output 3rd Order Intercept : +41.5 dBm typ. *
at 1960 MHz Surface-Mountable Power Plastic Package
Typical IP3, P1dB, Gain
45 40 35 30 25 20 15 10 5 0
IP3 IP3
dBm
P1dB Gain(dB)
P1dB Gain(dB)
Applications * PCS, Cellular Systems * High Linearity IF Amplifiers
850 MHz
1960 MHz
Symbol P 1dB S 21 S11 IP3 NF
Parameters: Test Conditions: Z0 = 50 Ohms, Ta = 25C Output Power at 1dB Compression Small signal gain Input VSWR Output Third Order Intercept Point (Pout/Tone = +11 dBm, Tone spacing = 1 MHz) Noise Figure f = 850 MHz f = 1960 MHz f = 850 MHz f = 1960 MHz f = 850 MHz f = 1960 MHz f = 850 MHz f = 1960 MHz f = 850 MHz f = 1960 MHz V s = 8V Rbias = 27 ohms Vdevice = 5 V typ.
Units dB m dB m dB dB dB m dB m dB dB mA C/W
Min.
Typ. 24.0 24.0
Max.
18.0
20.0 15.0 1.3:1 1.7:1
21.5
38.0
40.5 41.5 5.0 5.7
Id Rth, j-l
Device Current Thermal Resistance (junction - lead)
85
105 108
120
The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or omissions. Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the user's own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. Stanford Microdevices does not authorize or warrant any Stanford Microdevices product for use in life-support devices and/or systems. Copyright 2000 Stanford Microdevices, Inc. All worldwide rights reserved.
522 Almanor Ave., Sunnyvale, CA 94085
Phone: (800) SMI-MMIC
http://www.stanfordmicro.com
EDS-100622 Rev E
1
SXA-289 5-2000 MHz Power Amplifier
850 MHz Application Circuit Data, Icc=105mA, T=+25C, Rbias=27 ohm, Vs=8V
Note: Tuned for Output IP3 P1dB vs Frequency
26 25
dBm
Gain vs. Frequency
25 23
dB
24 23 22 21 800
-40C
25C 85C
21
25C -40C
19 17 15
85C
825
850
875
MHz
900
925
950
800
825
850
875
MHz
900
925
950
Input/Output Return Loss, Isolation vs Frequency
5 0 -5 -10 -15 -20 -25 -30 -35 800
45
S22
Third Order Intercept vs. Frequency (POUT per tone = 11dBm)
43
dBm
41 39 37 35 800
dB
25C 85C
S11
-40C
S12
850
MHz
900
950
825
850
875
MHz
900
925
950
Third Order Intercept vs Tone Power
44 42
25C
dBm Device Current (mA)
Device Current vs. Source Voltage
180 160 140 120 100 80 60 40 20 0 0
25C -40C 85C
40
85C
-40C
38 36 0 3 6 9 12 15
POUT per tone (dBm)
2
4
VS (V)
6
8
10
522 Almanor Ave., Sunnyvale, CA 94085
Phone: (800) SMI-MMIC
http://www.stanfordmicro.com
EDS-100622 Rev E
2
SXA-289 5-2000 MHz Power Amplifier
1960 MHz Application Circuit Data, Icc=105mA, T=+25C, Rbias=27 ohm, Vs=8V
Note: Tuned for Output IP3 P1dB vs Frequency
26 25
dBm
Gain vs. Frequency
20 18
-40C
dB
24 23 22 21 1930 1940
25C
85C
16
25C
-40C
14 12 10
1950 1960
MHz
85C
1970
1980
1990
1930
1940
1950
1960
MHz
1970
1980
1990
Input/Output Return Loss, Isolation vs Frequency
0 -5 -10
dB
44
S22 S11
dBm
Third Order Intercept vs. Frequency (POUT per tone = 11dBm)
42
25C 85C
-15 -20 -25 -30 -35 1930 1940 1950
40 38 36
-40C
S12
1960
MHz
1970
1980
1990
1930
1940
1950
1960
MHz
1970
1980
1990
Third Order Intercept vs Tone Power
Device Current vs. Source Voltage
44
25C
Device Current (mA)
42
dBm
40 38 36 34 0 3
85C -40C
180 160 140 120 100 80 60 40 20 0 0
25C -40C 85C
6
9
12
15
2
4
VS (V)
6
8
10
POUT per tone (dBm)
522 Almanor Ave., Sunnyvale, CA 94085
Phone: (800) SMI-MMIC
http://www.stanfordmicro.com
EDS-100622 Rev E
3
850 MHz Application Circuit
SXA-289 5-2000 MHz Power Amplifier
Voltage Feed Resistor Bias Circuit (for > 7V supply)
Vs
Recommended Bias Resistor Values Supply Voltage(Vs) 7V 18 0.5W 8V 27 1.0W 10V 47 1.5W 12V 62 2.0W
Rbias 0.1 F (SIZE A) 390 68pF
Rbias (Ohms) Power Rating
Rbias
1000pF 180 33 nH
Z=50, 12.9
33 nH
100 pF SXA-289
RFin
390 Ohms 180 Ohms
0.1uF 1000pF 68 pF
RFout
100pF
33nH
33nH
100pF
100 pF
5.6 pF
5.6pF SXA-289
850 MHz Schematic
STANFORD MICRODEVICES SOT-89 Eval Board ECB-101499 Rev A
850 MHz Evaluation Board Layout
Active Current Feedback Bias Circuit (for 5V supply)
Vs = 5V
0.1 F (SIZE A)
Frequency Small Signal Gain (dB) Input Return Loss (dB)
850 M H z 20.0 -22.8 37.7* 23.0
68 pF
220
2 6
Rbias=4.3
(Rohm) UMZ1N
1 5 3
Output IP3 (dBm) P1dB (dBm)
1000 pF
4
Vdev 33 nH
100 pF
*Note: IP3 performance degraded due to lower (4.5V) device voltage.
GND
UMZ1N 0.1 uF
220 1000pF 68pF
1.8 K 750
VCC
4.3
Z=50, 12.9
SXA-289
RF IN
100 pF
5.6 pF
1
1.8K
33nH
RF OUT
850 MHz Schematic
100pF 5.6pF
750
100pF
NOTE: Reference Application Note AN-026 for more information on Active Current Feedback Bias Circuit.
ALL COMPONENTS 0603 UNLESS NOTED OTHERWISE
STANFORD MICRODEVICES XAMP EVALUATION BOARD ECB-101872 Rev A SOT-89
850 MHz Active Bias Evaluation Board Layout
522 Almanor Ave., Sunnyvale, CA 94085
Phone: (800) SMI-MMIC
http://www.stanfordmicro.com
EDS-100622 Rev E
4
1960 MHz Application Circuit
SXA-289 5-2000 MHz Power Amplifier
Voltage Feed Resistor Bias Circuit (for > 7V supply)
Recommended Bias Resistor Values
Vs
Supply Voltage(Vs) Rbias (Ohms) Power Ratings
7V 18 0.5W
8V 27 1.0W
10V 47 1.5W
12V 62 2.0W
Rbias 0.1 F (SIZE A) 390 1000pF 180 22nH
Z=50, 45.5
22pF
Rbias
22nH 68pF
390 Ohms 180 Ohms
RFin
0.1uF 1000pF 22pF
RFout
68pF
22nH
22nH
68pF
68 pF
SXA-289
1.8 pF
SXA-289
1.8pF
1960 MHz Schematic
STANFORD MICRODEVICES SOT-89 Eval Board ECB-101499 Rev A
1960 MHz Evaluation Board Layout
Active Current Feedback Bias Circuit (for 5V supply)
Vs = 5V
Frequency Small Signal Gain (dB) Input Return Loss (dB) Output IP3 (dBm) 1960 M H z 14.9 -12.1 38.0* 23.3
0.1 F (SIZE A)
22 pF
220
2 6 1
(Rohm) UMZ1N
1000 pF
4 5 3
Rbias=4.3 Vdev 22nH
P1dB(dBm)
*Note: IP3 performance degraded due to lower (4.5V) device voltage.
GND
1.8 K 750 68 pF
68pF
Z=50, 45.5
UMZ1N 0.1 uF
220 22pF
VCC
4.3
1000pF 1.8K 22nH
SXA-289
1.2 pF
RF IN
1
RF OUT
1960 MHz Schematic
68pF
750 1.2pF
68pF
NOTE: Reference Application Note AN-026 for more information on Active Current Feedback Bias Circuit.
ALL COMPONENTS 0603 UNLESS NOTED OTHERWISE
STANFORD MICRODEVICES XAMP EVALUATION BOARD ECB-101872 Rev A SOT-89
1960 MHz Active Bias Evaluation Board Layout
522 Almanor Ave., Sunnyvale, CA 94085
Phone: (800) SMI-MMIC
http://www.stanfordmicro.com
EDS-100622 Rev E
5
Absolute Maximum Ratings
Parameter
Device Voltage Device Current Power Dissipation RF Input Power Junction Temperature Operating Temperature Storage Temperature
SXA-289 5-2000 MHz Power Amplifier
Part Number Ordering Information
Part Number
SXA-289
Absolute Maximum
6V 200mA 1500mW 100mW +150C -40C to +85C -65C to +150C
Pin # 1 2 3 4
Devices Per Reel
1000
Reel Size
7"
Part Symbolization The part will be symbolized with a "XA2" designator on the top surface of the package. Pin Description
Function Base GND & Emitter Collector Base Pin Connection to ground. Use via holes to reduce lead inductance. Place vias as close to ground leads as possible. Collector Pin Description
Caution: ESD sensitive
Appropriate precautions in handling, packaging and testing devices must be observed.
GND & Emitter Same as Pin 2
Package Dimensions
.161.006 .096.006 .041.006 .008 .059.004 .038.002 .036.002
.048.002 .010.002 TYP(2X)
.016REF .118REF .177.004 .118.003 .059.003 .019 +.003 -.002 .059
.010 .068.004 .034 .016 +.003 -.002
.030.004 .105.002
MARKING AREA
DOT DENOTES PIN 1
+3 5 -4 .041REF
.117.002
TOP VIEW
.024.004 .161 REF
+.002 .015 -.001 TYP(4X)
PCB Pad Layout
Recommended via and mounting hole pattern (For RF Ground and Thermal considerations)
DIMENSIONS ARE IN INCHES [MM]
Use multiple plated-through vias holes located close to the package pins to ensure a good RF ground connection to a continuous groundplane on the backside of the board.
522 Almanor Ave., Sunnyvale, CA 94085
Phone: (800) SMI-MMIC
http://www.stanfordmicro.com
EDS-100622 Rev E
6


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